META 2017 Workshop on Meta-Programming Techniques and Reflection
The Meta’17 workshop aims to bring together researchers working on metaprogramming and reflection, as well as users building applications, language extensions, or software tools. With the changing hardware and software landscape, and increased heterogeneity of systems, metaprogramming becomes an important research topic to handle the associate complexity once more.
Contributions to the workshop are welcome on a wide range of topics related to design, implementation, and application of metaprogramming techniques, as well as empirical studies on and typing for such systems and languages.
Call for Papers
This workshop aims to explore meta-level technologies that help tackling the heterogeneity, scalability and openness requirements of emerging computations platforms.
Topics of Interest
The workshop is a venue for all approaches that embrace metaprogramming:
- from static to dynamic techniques
- reflection, meta-level architectures, staging, open language runtimes applications to middleware, frameworks, and DSLs
- optimization techniques to minimize runtime overhead
- contract systems, or typing of reflective programs reflection and metaobject protocols to enable tooling
- case studies and evaluation of such techniques, e.g., to build applications, language extensions, or tools
- empirical evaluation of metaprogramming solutions
- security in reflective systems and capability-based designs
- meta-level architectures and reflective middleware for modern runtime platforms (e.g. IoT, cyber-physical systems, mobile/cloud/grid computing, etc)
- surveys, conceptualization, and taxonomization of existing approaches
In short, we invite contributions to the workshop on a wide range of topics related to design, implementation, and application of reflective APIs and meta-programming techniques, as well as empirical studies and typing for such systems and languages.
Workshop Format and Submissions
This workshop welcomes the presentation of new ideas and emerging problems as well as mature work as part of a mini-conference format. Furthermore, we plan interactive brainstorming and demonstration sessions between the formal presentations to enable an active exchange of ideas. Therefore, we seek the following kinds of publications:
- technical paper: max. 8 pages, excluding references
- position and work-in-progress paper: 1-4 pages, excluding references
- technology demos or a posters: 1-page abstract
For the submission, please use the submission system at: https://meta17.hotcrp.com/
The workshop technical papers will be published in the ACM DL, if not requested otherwise by the authors. Thus, they will be part of SPLASH workshop proceedings. Demos, posters, position and work-in-progress papers can be submitted on a second, later deadline to discuss the latest results and current work and won’t be included in the ACM DL proceedings.
Abstract Submission: 07 August 2017
Paper Submission: 20 August 2017
Author Notification: 06 September 2017
Position/WIP Paper Deadline: 08 September 2017
Camera Ready Deadline: 18 September 2017
Position/WIP Notification: 21 September 2017
The program committee consists of the organizers and the following reviewers:
Anya Helen Bagge, University of Bergen, Norway
Carl Friedrich Bolz-Tereick, Germany
Daniele Bonetta, Oracle Labs, Austria
Nicolas Cardozo, Universidad de los Andes, Colombia
Sebastian Erdweg, TU Delf, The Nederlands
Robert Hirschfeld, HPI, Germany
Roberto Ierusalimschy, PUC-Rio, Brazil
Pablo Inostroza, CWI, The Nederlands
Kim Mens, Universite Catholique de Louvain, Belgium
Cyrus Omar, Carnegie Mellon University, USA
Guillermo Polito, CNRS, France
Tiark Rompf, Purdue University, USA
Tom Van Cutsem, Nokia Bell Labs, Belgium
Takuo Watanabe, Tokyo Institute of Technology, Japan
Shigeru Chiba, University of Tokyo
Elisa Gonzalez Boix, Vrije Universiteit Brussel
Stefan Marr, Johannes Kepler University Linz
For questions, please contact us via m…@soft.vub.ac.be.
Instructions for Authors
For fairness reasons, all submitted papers have to conform to the formatting instructions below. Submissions that violate these instructions may be rejected without review.
Please take a moment to read the instructions below before using the submission site.
Submissions are to be made via: https://meta17.hotcrp.com/
Technical papers and all material to be included in the ACM DL must describe unpublished work that is not currently submitted for publication elsewhere as described by SIGPLAN’s Republication Policy. Submitters should also be aware of ACM’s Policy and Procedures on Plagiarism.
Submissions should use the ACM SIGPLAN Conference
acmart Format with ‘sigplan’ Subformat, 10 point font, using the font family Times New Roman. All submissions should be in PDF format. If you use LaTeX or Word, please use the provided ACM SIGPLAN
acmart Templates provided here. Otherwise, follow the author instructions.
If you are formatting your paper using LaTeX, you will need to set the
10pt option in the
\documentclass command. If you are formatting your paper using Word, you may wish to use the provided Word template that supports this font size.
Please include page numbers in your submission with the LaTeX
Please also ensure that your submission is legible when printed on a black and white printer. In particular, please check that colors remain distinct and font sizes are legible.
Publication (Digital Library Early Access Warning)
AUTHORS TAKE NOTE: The official publication date is the date the proceedings are made available in the ACM Digital Library. This date may be up to two weeks prior to the first day of the conference. The official publication date affects the deadline for any patent filings related to published work.
|Sun 20 Aug 2017updated|
|Wed 6 Sep 2017|
|Fri 8 Sep 2017|
Position/WIP Paper Submission
|Mon 18 Sep 2017|
Camera Ready Deadline
|Thu 21 Sep 2017|
Position/WIP Paper Notification
|Sun 22 Oct 2017|
Anya Helene Bagge
University of Bergen
Carl Friedrich Bolz-Tereick
Universidad de los Andes
Université Catholique de Louvain, Belgium
Carnegie Mellon University
Tom Van Cutsem
Nokia Bell Labs
Tokyo Institute of Technology